These include: (a) mechanics of nanoscale machining of ferrous and non-ferrous materials; (b) physics of nanoscale grinding of semiconductor materials; (c) effects of simulating a variety of machining parameters in order to minimize sub-surface damage; (d) modeling of exit failures experienced during machining such as burr formation and other dynamic instabilities during chip formation; (e) simulation of known defects in microstructures using molecular dynamic simulations,statistical mechanical,and Monte Carlo methods; (f) simulation of machining single crystals of known orientation; (g) extremely high speed nanometric cutting; (h) tool wear during machining; and (i) the effects of hardness on the wear of tool and workpiece materials.The nature of wear of the material ahead of the machining and grinding process,the variation of machining forces,and the amount of specific energy induced into the workpiece material using molecular dynamic simulations is discussed in this chapter.
Nanotechnology is the creation and utilization of materials,structures,devices and systems through the control of matter at the nanometer length scale.
The essence of nanotechnology is the ability to work at these levels to generate large structures with fundamentally new properties.Although certain applications of nanotechnology,such as giant magnetoresistance (GMR) structures for computer hard disk read head and polymer displays have entered the marketplace,in general nanotechnology is still at a very early stage of development.
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